Embodied Emissions

12. Related Documents

Standards, research, and sources referenced by the methodology.

Greenpixie Methodologies

Standards and Protocols

  • World Resources Institute and WBCSD, The Greenhouse Gas Protocol: A Corporate Accounting and Reporting Standard, Revised Edition, 2004.
  • World Resources Institute and WBCSD, Corporate Value Chain (Scope 3) Accounting and Reporting Standard, 2011.
  • World Resources Institute and WBCSD, Product Life Cycle Accounting and Reporting Standard, 2011.
  • International Organization for Standardization, ISO 14040:2006.
  • International Organization for Standardization, ISO 14044:2006.
  • International Organization for Standardization, ISO 14064-1:2018.
  • International Organization for Standardization, ISO 14067:2018.

Regulatory Sources

  • European Parliament and Council of the European Union, Directive (EU) 2022/2464 as regards corporate sustainability reporting (Corporate Sustainability Reporting Directive), 2022.
  • HM Government (UK), Environmental Reporting Guidelines: Including Streamlined Energy and Carbon Reporting Guidance, 2019.
  • Securities and Exchange Commission (US), The Enhancement and Standardization of Climate-Related Disclosures for Investors, 2024.

Lifecycle Assessment and Embodied Emissions

  • Boavizta, BoaviztAPI, accessed September 2026.
  • Falk, S. et al., More than Carbon: Cradle-to-Grave Environmental Impacts of GenAI Training on the Nvidia A100 GPU, arXiv:2509.00093, 2025.
  • Gröger, J. et al., Green Cloud Computing: Lebenszyklusbasierte Datenerhebung zu Umweltwirkungen des Cloudcomputing, Umweltbundesamt (German Federal Environment Agency), TEXTE 94/2021, 2021.
  • Gupta, U. et al., ACT: Designing Sustainable Computer Systems With An Architectural Carbon Modeling Tool, 49th Annual International Symposium on Computer Architecture, 2022.

Hardware Life Cycle Assessments

  • Cisco, N9324C-SE1U ISO-Aligned Life Cycle Assessment Report, 2025.
  • Dell, Life Cycle Assessment of Dell R740, 2019.
  • Dell, Life Cycle Assessment Dell Servers R6515, R7515, R6525, R7525, 2021.
  • NVIDIA, Product Carbon Footprint Summary for NVIDIA HGX H100, accessed September 2026.
  • NVIDIA, Product Carbon Footprint Summary for NVIDIA HGX B200, accessed September 2026.
  • Seagate, Nytro 1551 Sustainability Report, 2019.
  • Seagate, Exos X18 Sustainability Report, 2021.

Semiconductor Specification and Die Analysis

  • Handy, J., 64-Layer 3D NAND Chips Revealed at ISSCC, The Memory Guy, 2017.
  • TechInsights, Micron 176L 3D NAND, accessed September 2026.
  • TechInsights, Industry-Leading DDR5 Technology, accessed September 2026.
  • TechInsights, Comparison: Latest 3D NAND Products from YMTC, Samsung, SK hynix and Micron, 2023.
  • TechPowerUp, TechPowerUp CPU Database, accessed September 2026.
  • TechPowerUp, TechPowerUp GPU Database, accessed September 2026.

Cloud Provider Sources

  • Amazon Web Services, Amazon EC2 Instance Type Specifications, accessed September 2026.
  • Google Cloud, Machine Families Resource and Comparison Guide, accessed September 2026.
  • Microsoft Azure, Azure Virtual Machines Sizes Documentation, accessed September 2026.

11. Outputs and Interpretation

Primary outputs, intended use, and interpretation guidance.

13. Notice on Intellectual Property and Permitted Use

IP notice and permitted use of this document.

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Greenpixie MethodologiesStandards and ProtocolsRegulatory SourcesLifecycle Assessment and Embodied EmissionsHardware Life Cycle AssessmentsSemiconductor Specification and Die AnalysisCloud Provider Sources